- All sections
- H - Electricity
- H01R - Electrically-conductive connections; structural associations of a plurality of mutually-insulated electrical connecting elements; coupling devices; current collectors
- H01R 13/658 - High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
Patent holdings for IPC class H01R 13/658
Total number of patents in this class: 689
10-year publication summary
|
40
|
45
|
55
|
47
|
31
|
36
|
48
|
29
|
13
|
3
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Molex Incorporated | 609 |
45 |
| FCI | 537 |
26 |
| Foxconn Interconnect Technology Limited | 1034 |
22 |
| Yazaki Corporation | 6282 |
20 |
| Tyco Electronics Corporation | 792 |
19 |
| Apple Inc. | 50209 |
18 |
| Amphenol Corporation | 748 |
18 |
| TE Connectivity Solutions GmbH | 2580 |
18 |
| Sumitomo Wiring Systems, Ltd. | 9367 |
17 |
| Sumitomo Electric Industries, Ltd. | 14131 |
16 |
| Molex, LLC | 1792 |
16 |
| 3m Innovative Properties Company | 18406 |
15 |
| AutoNetworks Technologies, Ltd. | 5809 |
14 |
| Advanced Connectek Inc. | 338 |
11 |
| Japan Aviation Electronics Industry, Limited | 1585 |
10 |
| PPC Broadband, Inc. | 1017 |
10 |
| Intel Corporation | 45621 |
9 |
| Hon Hai Precision Industry Co., Ltd. | 4157 |
7 |
| Rosenberger Hochfrequenztechnik GmbH & Co. KG | 677 |
7 |
| Huawei Technologies Co., Ltd. | 100781 |
6 |
| Other owners | 365 |